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Huizhou Tian Yi Rare Material Co.,Ltd

http://allelem.tradekorea.com

TYR has been established in 2004 year, specializes in a wide category of sputtering targets, evaporation source material, rare earth material and chemistry reagent, PVD materials base on metals, alloys, compounds. we offer targets bonding service, we serving government research establishments, universities and high technology industries. We using a variety of specialized processes including hot pressing, hot/cold isostatic pressing, and vacuum melting, vacuum sintering, we can provide the kind of homogenous, fine-grained, high-density materials that conform to the strictest quality control, we always aim to put quality first.Our product list include Metal sputtering targets, Alloy sputtering targets, Noble metal sputtering targets, Noble alloy sputtering targets, Oxide Ceramic Sputtering targets, Boride Ceramic Sputtering Targets, Carbide Ceramic Sputtering Targets, Fluoride Ceramic Sputtering Targets, Nitride Ceramic Sputtering Targets, Sulfide Ceramic Sputtering Targets, Selenide Ceramic Sputtering Targets, Silicide Ceramic Sputtering Targets, Telluride Ceramic Sputtering Targets, metal evaporation source, alloy evaporation source, optical thin film coating material, rare earth oxide and each high pure chemistry reagent.Sputtering Targets Materials list:High Pure Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper (Cu), Dysprosium (Dy), Erbium (Er), Eur (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), Lanthanum (La), Lead (Pb), Lutetium (Lu), Manganese (Mn), Molybdenum (Mo), Magnesium (Mg), Neodymium (Nd), Niobium (Nb), Nickel (Ni), Palladium (Pd), Platinum (Pt), Praseodymium (Pr), Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc), Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn) ;Alloy Sputtering Targets: Al alloy targets, Al-Cu, Al-Cr, Al-Nd, Al-Si, Al-Si-Cu, Al-AgCu alloy targets: Cu-Ag, Cu-Co, Cu-Ga, Cu-In, Cu-NiCo alloy targets: Co-Cr, Co-Cr-Mo, Co-Fe, Co-Fe-B ,Co-Ni, Co-Ni-Cr, Co-PtNi alloy targets: Ni-Al, Ni-Cr, Ni-Cr-Si, Ni-Fe, Ni-Mn, Ni-Ti, Ni-V, Ti alloy targets: Ti-Al, Ti-Ni, Ti-Zr, Ti-Co Ta alloy targets: Ta-Al, Ta-W W alloy targets: W-Ti, W-Mo, W-B, W-Re Mo alloy targets: Mo-Nb, Mo-Si, Mo-AlFe alloy targets: Fe-B, Fe-Co, Fe-Mn, Fe-Hf, Fe-Gd, Fe-Tb Zr alloy targets: ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY, Noble alloy targets: Au-Ag, Ag-Cu, Ir-Mn, Ir-Re, Ir-Ru, Au-Sn, Ag-In, Ag-Sn e.t.cCeramic sputtering target: Oxide Ceramic Sputtering targets: Al2O3, AZO, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, In2O3-SnO2 (ITO), Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu2O3, MgO, MoO3, Nd2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, Tm2O3, TiO, TiO2, Ti3O5, Ti2O3, SnO2, SnO, WO3, WO3-Li, V2O5, VO2, Yb2O3, Y2O3, Y2O3-ZrO2 (YSZ), YBCO, ZnO, ZnO:Al, ZnO-In2O3, ZrO2, ZrO2-5-15wt%CaO) Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, TaB2, TiB2, W2B5, WB, VB, YB6, ZrB2 Carbide Ceramic Sputtering Targets : B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrC Fluoride Ceramic Sputtering Targets : AlF3, BaF2, CaF2, LiF, MgF2, NaF, Na3AlF6, YF3, YbF3 Nitride Ceramic Sputtering Targets :AlN, BN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN Sulfide Ceramic Sputtering Targets: CuS, Cu2S, CdS, FeS, FeS2, GeS, SnS, In2S3, MoS2, TaS2, WS2, ZnSSelenide Ceramic Sputtering Targets: Bi2Se3, CdSe, CuSe, Ga2Se3, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSeSilicide Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2Telluride Ceramic Sputtering Targets: Bi2Te3, CdTe, CuTe, Ga2Te3, GeTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe  

Iridium

Ruthenium, Ru

scandium oxide,

Gallium oxide,

Titanium oxide

Zirconium dioxide

Titanium Boride,

Zinc sulfide, ZnS

Lithium phosphate

Rubidium

Iridium

Ruthenium, Ru

scandium oxide,

Gallium oxide,

Titanium oxide

Zirconium dioxide

Titanium Boride,

Zinc sulfide, ZnS

Lithium phosphate

Rubidium

 

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Company Introduction

ZOOM
TYR has been established in 2004 year, specializes in a wide category of sputtering targets, evaporation source material, rare earth material and chemistry reagent, PVD materials base on metals, alloys, compounds.

we offer targets bonding service, we serving government research establishments, universities and high technology industries.

We using a variety of specialized processes including hot pressing, hot/cold isostatic pressing, and vacuum melting, vacuum sintering, we can provide the kind of homogenous, fine-grained, high-density materials that conform to the strictest quality control, we always aim to put quality first.

Our product list include Metal sputtering targets, Alloy sputtering targets, Noble metal sputtering targets, Noble alloy sputtering targets, Oxide Ceramic Sputtering targets, Boride Ceramic Sputtering Targets, Carbide Ceramic Sputtering Targets, Fluoride Ceramic Sputtering Targets, Nitride Ceramic Sputtering Targets, Sulfide Ceramic Sputtering Targets, Selenide Ceramic Sputtering Targets, Silicide Ceramic Sputtering Targets, Telluride Ceramic Sputtering Targets, metal evaporation source, alloy evaporation source, optical thin film coating material, rare earth oxide and each high pure chemistry reagent.

Sputtering Targets Materials list:
High Pure Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper (Cu), Dysprosium (Dy), Erbium (Er), Eur (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), Lanthanum (La), Lead (Pb), Lutetium (Lu), Manganese (Mn), Molybdenum (Mo), Magnesium (Mg), Neodymium (Nd), Niobium (Nb), Nickel (Ni), Palladium (Pd), Platinum (Pt), Praseodymium (Pr), Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc), Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn) ;

Alloy Sputtering Targets:
Al alloy targets, Al-Cu, Al-Cr, Al-Nd, Al-Si, Al-Si-Cu, Al-Ag
Cu alloy targets: Cu-Ag, Cu-Co, Cu-Ga, Cu-In, Cu-Ni
Co alloy targets: Co-Cr, Co-Cr-Mo, Co-Fe, Co-Fe-B ,Co-Ni, Co-Ni-Cr, Co-Pt
Ni alloy targets: Ni-Al, Ni-Cr, Ni-Cr-Si, Ni-Fe, Ni-Mn, Ni-Ti, Ni-V,
Ti alloy targets: Ti-Al, Ti-Ni, Ti-Zr, Ti-Co
Ta alloy targets: Ta-Al, Ta-W
W alloy targets: W-Ti, W-Mo, W-B, W-Re
Mo alloy targets: Mo-Nb, Mo-Si, Mo-Al
Fe alloy targets: Fe-B, Fe-Co, Fe-Mn, Fe-Hf, Fe-Gd, Fe-Tb
Zr alloy targets: ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY,
Noble alloy targets: Au-Ag, Ag-Cu, Ir-Mn, Ir-Re, Ir-Ru, Au-Sn, Ag-In, Ag-Sn e.t.c

Ceramic sputtering target: Oxide Ceramic Sputtering targets: Al2O3, AZO, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, In2O3-SnO2 (ITO), Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu2O3, MgO, MoO3, Nd2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, Tm2O3, TiO, TiO2, Ti3O5, Ti2O3, SnO2, SnO, WO3, WO3-Li, V2O5, VO2, Yb2O3, Y2O3, Y2O3-ZrO2 (YSZ), YBCO, ZnO, ZnO:Al, ZnO-In2O3, ZrO2, ZrO2-5-15wt%CaO)

Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, TaB2, TiB2, W2B5, WB, VB, YB6, ZrB2

Carbide Ceramic Sputtering Targets : B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrC

Fluoride Ceramic Sputtering Targets : AlF3, BaF2, CaF2, LiF, MgF2, NaF, Na3AlF6, YF3, YbF3

Nitride Ceramic Sputtering Targets :AlN, BN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN

Sulfide Ceramic Sputtering Targets: CuS, Cu2S, CdS, FeS, FeS2, GeS, SnS, In2S3, MoS2, TaS2, WS2, ZnS

Selenide Ceramic Sputtering Targets: Bi2Se3, CdSe, CuSe, Ga2Se3, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe

Silicide Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2

Telluride Ceramic Sputtering Targets: Bi2Te3, CdTe, CuTe, Ga2Te3, GeTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe
 
 

Detailed Company Information

Huizhou Tian Yi Rare Material Co.,Ltd

  • Business Type
  • Year Established
  • Location China
  • Main Markets Germany,Egypt,France, Metropolitan,U. Kingdom,Hong Kong(China),India,Japan,South Korea,U.S.A
  • Total Employees 1-50 People
  • Homepage -
  • President Amy Chiu
  • Phone +86-0752-2021-182
  • FAX +86-0752-2021-180
  • Address 12 K of Shiji, Shijixingtian Bldg, YanDa Road, Huizhou, China
  • Product Category Electrical Components & Telecoms > Electrical Components > Electrical Supplies > Semiconductors
    Industrial Supplies
    Industrial Supplies > Minerals & Metallurgy > Other Minerals & Metallurgy Products
  • Factory Information

Additional Introduction

TYR has been established in 2004 year, specializes in a wide category of sputtering targets, evaporation source material, rare earth material and chemistry reagent, PVD materials base on metals, alloys, compounds. we offer targets bonding service, we serving government research establishments, universities and high technology industries. We using a variety of specialized processes including hot pressing, hot/cold isostatic pressing, and vacuum melting, vacuum sintering, we can provide the kind of homogenous, fine-grained, high-density materials that conform to the strictest quality control, we always aim to put quality first. Our product list include Metal sputtering targets, Alloy sputtering targets, Noble metal sputtering targets, Noble alloy sputtering targets, Oxide Ceramic Sputtering targets, Boride Ceramic Sputtering Targets, Carbide Ceramic Sputtering Targets, Fluoride Ceramic Sputtering Targets, Nitride Ceramic Sputtering Targets, Sulfide Ceramic Sputtering Targets, Selenide Ceramic Sputtering Targets, Silicide Ceramic Sputtering Targets, Telluride Ceramic Sputtering Targets, metal evaporation source, alloy evaporation source, optical thin film coating material, rare earth oxide and each high pure chemistry reagent. Sputtering Targets Materials list: High Pure Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper (Cu), Dysprosium (Dy), Erbium (Er), Eur (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), Lanthanum (La), Lead (Pb), Lutetium (Lu), Manganese (Mn), Molybdenum (Mo), Magnesium (Mg), Neodymium (Nd), Niobium (Nb), Nickel (Ni), Palladium (Pd), Platinum (Pt), Praseodymium (Pr), Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc), Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn) ; Alloy Sputtering Targets: Al alloy targets, Al-Cu, Al-Cr, Al-Nd, Al-Si, Al-Si-Cu, Al-Ag Cu alloy targets: Cu-Ag, Cu-Co, Cu-Ga, Cu-In, Cu-Ni Co alloy targets: Co-Cr, Co-Cr-Mo, Co-Fe, Co-Fe-B ,Co-Ni, Co-Ni-Cr, Co-Pt Ni alloy targets: Ni-Al, Ni-Cr, Ni-Cr-Si, Ni-Fe, Ni-Mn, Ni-Ti, Ni-V, Ti alloy targets: Ti-Al, Ti-Ni, Ti-Zr, Ti-Co Ta alloy targets: Ta-Al, Ta-W W alloy targets: W-Ti, W-Mo, W-B, W-Re Mo alloy targets: Mo-Nb, Mo-Si, Mo-Al Fe alloy targets: Fe-B, Fe-Co, Fe-Mn, Fe-Hf, Fe-Gd, Fe-Tb Zr alloy targets: ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY, Noble alloy targets: Au-Ag, Ag-Cu, Ir-Mn, Ir-Re, Ir-Ru, Au-Sn, Ag-In, Ag-Sn e.t.c Ceramic sputtering target: Oxide Ceramic Sputtering targets: Al2O3, AZO, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, In2O3-SnO2 (ITO), Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu2O3, MgO, MoO3, Nd2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, Tm2O3, TiO, TiO2, Ti3O5, Ti2O3, SnO2, SnO, WO3, WO3-Li, V2O5, VO2, Yb2O3, Y2O3, Y2O3-ZrO2 (YSZ), YBCO, ZnO, ZnO:Al, ZnO-In2O3, ZrO2, ZrO2-5-15wt%CaO) Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, TaB2, TiB2, W2B5, WB, VB, YB6, ZrB2 Carbide Ceramic Sputtering Targets : B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrC Fluoride Ceramic Sputtering Targets : AlF3, BaF2, CaF2, LiF, MgF2, NaF, Na3AlF6, YF3, YbF3 Nitride Ceramic Sputtering Targets :AlN, BN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN Sulfide Ceramic Sputtering Targets: CuS, Cu2S, CdS, FeS, FeS2, GeS, SnS, In2S3, MoS2, TaS2, WS2, ZnS Selenide Ceramic Sputtering Targets: Bi2Se3, CdSe, CuSe, Ga2Se3, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe Silicide Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2 Telluride Ceramic Sputtering Targets: Bi2Te3, CdTe, CuTe, Ga2Te3, GeTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe
Home

Company Introduction

TYR has been established in 2004 year, specializes in a wide category of sputtering targets, evaporation source material, rare earth material and chemistry reagent, PVD materials base on metals, alloys, compounds.

we offer targets bonding service, we serving government research establishments, universities and high technology industries.

We using a variety of specialized processes including hot pressing, hot/cold isostatic pressing, and vacuum melting, vacuum sintering, we can provide the kind of homogenous, fine-grained, high-density materials that conform to the strictest quality control, we always aim to put quality first.

Our product list include Metal sputtering targets, Alloy sputtering targets, Noble metal sputtering targets, Noble alloy sputtering targets, Oxide Ceramic Sputtering targets, Boride Ceramic Sputtering Targets, Carbide Ceramic Sputtering Targets, Fluoride Ceramic Sputtering Targets, Nitride Ceramic Sputtering Targets, Sulfide Ceramic Sputtering Targets, Selenide Ceramic Sputtering Targets, Silicide Ceramic Sputtering Targets, Telluride Ceramic Sputtering Targets, metal evaporation source, alloy evaporation source, optical thin film coating material, rare earth oxide and each high pure chemistry reagent.

Sputtering Targets Materials list:
High Pure Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper (Cu), Dysprosium (Dy), Erbium (Er), Eur (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), Lanthanum (La), Lead (Pb), Lutetium (Lu), Manganese (Mn), Molybdenum (Mo), Magnesium (Mg), Neodymium (Nd), Niobium (Nb), Nickel (Ni), Palladium (Pd), Platinum (Pt), Praseodymium (Pr), Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc), Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn) ;

Alloy Sputtering Targets:
Al alloy targets, Al-Cu, Al-Cr, Al-Nd, Al-Si, Al-Si-Cu, Al-Ag
Cu alloy targets: Cu-Ag, Cu-Co, Cu-Ga, Cu-In, Cu-Ni
Co alloy targets: Co-Cr, Co-Cr-Mo, Co-Fe, Co-Fe-B ,Co-Ni, Co-Ni-Cr, Co-Pt
Ni alloy targets: Ni-Al, Ni-Cr, Ni-Cr-Si, Ni-Fe, Ni-Mn, Ni-Ti, Ni-V,
Ti alloy targets: Ti-Al, Ti-Ni, Ti-Zr, Ti-Co
Ta alloy targets: Ta-Al, Ta-W
W alloy targets: W-Ti, W-Mo, W-B, W-Re
Mo alloy targets: Mo-Nb, Mo-Si, Mo-Al
Fe alloy targets: Fe-B, Fe-Co, Fe-Mn, Fe-Hf, Fe-Gd, Fe-Tb
Zr alloy targets: ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY,
Noble alloy targets: Au-Ag, Ag-Cu, Ir-Mn, Ir-Re, Ir-Ru, Au-Sn, Ag-In, Ag-Sn e.t.c

Ceramic sputtering target: Oxide Ceramic Sputtering targets: Al2O3, AZO, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, In2O3-SnO2 (ITO), Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu2O3, MgO, MoO3, Nd2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, Tm2O3, TiO, TiO2, Ti3O5, Ti2O3, SnO2, SnO, WO3, WO3-Li, V2O5, VO2, Yb2O3, Y2O3, Y2O3-ZrO2 (YSZ), YBCO, ZnO, ZnO:Al, ZnO-In2O3, ZrO2, ZrO2-5-15wt%CaO)

Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, TaB2, TiB2, W2B5, WB, VB, YB6, ZrB2

Carbide Ceramic Sputtering Targets : B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrC

Fluoride Ceramic Sputtering Targets : AlF3, BaF2, CaF2, LiF, MgF2, NaF, Na3AlF6, YF3, YbF3

Nitride Ceramic Sputtering Targets :AlN, BN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN

Sulfide Ceramic Sputtering Targets: CuS, Cu2S, CdS, FeS, FeS2, GeS, SnS, In2S3, MoS2, TaS2, WS2, ZnS

Selenide Ceramic Sputtering Targets: Bi2Se3, CdSe, CuSe, Ga2Se3, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe

Silicide Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2

Telluride Ceramic Sputtering Targets: Bi2Te3, CdTe, CuTe, Ga2Te3, GeTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe
 
 

Company Profile

Huizhou Tian Yi Rare Material Co.,Ltd

  • Business Type
  • Year Established
  • Location China
  • Main Markets Germany,Egypt,France, Metropolitan,U. Kingdom,Hong Kong(China),India,Japan,South Korea,U.S.A
  • Total Employees 1-50 People
  • Homepage -
  • President Amy Chiu
  • Phone +86-0752-2021-182
  • FAX +86-0752-2021-180
  • Address 12 K of Shiji, Shijixingtian Bldg, YanDa Road, Huizhou, China
  • Product Category Electrical Components & Telecoms > Electrical Components > Electrical Supplies > Semiconductors
    Industrial Supplies
    Industrial Supplies > Minerals & Metallurgy > Other Minerals & Metallurgy Products
  • Factory Information

Additional Introduction

TYR has been established in 2004 year, specializes in a wide category of sputtering targets, evaporation source material, rare earth material and chemistry reagent, PVD materials base on metals, alloys, compounds. we offer targets bonding service, we serving government research establishments, universities and high technology industries. We using a variety of specialized processes including hot pressing, hot/cold isostatic pressing, and vacuum melting, vacuum sintering, we can provide the kind of homogenous, fine-grained, high-density materials that conform to the strictest quality control, we always aim to put quality first. Our product list include Metal sputtering targets, Alloy sputtering targets, Noble metal sputtering targets, Noble alloy sputtering targets, Oxide Ceramic Sputtering targets, Boride Ceramic Sputtering Targets, Carbide Ceramic Sputtering Targets, Fluoride Ceramic Sputtering Targets, Nitride Ceramic Sputtering Targets, Sulfide Ceramic Sputtering Targets, Selenide Ceramic Sputtering Targets, Silicide Ceramic Sputtering Targets, Telluride Ceramic Sputtering Targets, metal evaporation source, alloy evaporation source, optical thin film coating material, rare earth oxide and each high pure chemistry reagent. Sputtering Targets Materials list: High Pure Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper (Cu), Dysprosium (Dy), Erbium (Er), Eur (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), Lanthanum (La), Lead (Pb), Lutetium (Lu), Manganese (Mn), Molybdenum (Mo), Magnesium (Mg), Neodymium (Nd), Niobium (Nb), Nickel (Ni), Palladium (Pd), Platinum (Pt), Praseodymium (Pr), Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc), Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn) ; Alloy Sputtering Targets: Al alloy targets, Al-Cu, Al-Cr, Al-Nd, Al-Si, Al-Si-Cu, Al-Ag Cu alloy targets: Cu-Ag, Cu-Co, Cu-Ga, Cu-In, Cu-Ni Co alloy targets: Co-Cr, Co-Cr-Mo, Co-Fe, Co-Fe-B ,Co-Ni, Co-Ni-Cr, Co-Pt Ni alloy targets: Ni-Al, Ni-Cr, Ni-Cr-Si, Ni-Fe, Ni-Mn, Ni-Ti, Ni-V, Ti alloy targets: Ti-Al, Ti-Ni, Ti-Zr, Ti-Co Ta alloy targets: Ta-Al, Ta-W W alloy targets: W-Ti, W-Mo, W-B, W-Re Mo alloy targets: Mo-Nb, Mo-Si, Mo-Al Fe alloy targets: Fe-B, Fe-Co, Fe-Mn, Fe-Hf, Fe-Gd, Fe-Tb Zr alloy targets: ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY, Noble alloy targets: Au-Ag, Ag-Cu, Ir-Mn, Ir-Re, Ir-Ru, Au-Sn, Ag-In, Ag-Sn e.t.c Ceramic sputtering target: Oxide Ceramic Sputtering targets: Al2O3, AZO, Sb2O3, ATO, BaTiO3, Bi2O3, CeO2, CuO, Cr2O3, Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, In2O3-SnO2 (ITO), Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu2O3, MgO, MoO3, Nd2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, Tm2O3, TiO, TiO2, Ti3O5, Ti2O3, SnO2, SnO, WO3, WO3-Li, V2O5, VO2, Yb2O3, Y2O3, Y2O3-ZrO2 (YSZ), YBCO, ZnO, ZnO:Al, ZnO-In2O3, ZrO2, ZrO2-5-15wt%CaO) Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, TaB2, TiB2, W2B5, WB, VB, YB6, ZrB2 Carbide Ceramic Sputtering Targets : B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, WC, W2C, VC, ZrC Fluoride Ceramic Sputtering Targets : AlF3, BaF2, CaF2, LiF, MgF2, NaF, Na3AlF6, YF3, YbF3 Nitride Ceramic Sputtering Targets :AlN, BN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN Sulfide Ceramic Sputtering Targets: CuS, Cu2S, CdS, FeS, FeS2, GeS, SnS, In2S3, MoS2, TaS2, WS2, ZnS Selenide Ceramic Sputtering Targets: Bi2Se3, CdSe, CuSe, Ga2Se3, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe Silicide Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2 Telluride Ceramic Sputtering Targets: Bi2Te3, CdTe, CuTe, Ga2Te3, GeTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe

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